Technical Articles
Design | Products | Test and Measurement | IC Processing/Reliability
| Category | ID | Description |
| Design |
TA007 | Balance Tradeoffs in GaAs FET LNAs - Design Feature (Microwave & RF - Feb 2000) |
| TA008 | A General Design Procedure For Bandpass Filters Derived From Low Pass Proto-type Elements - Tutorial Part I (Microwave Journal - Dec 2000) | |
| TA009 | A General Design Procedure For Bandpass Filters Derived From Low Pass Proto-type Elements - Tutorial Part II (Microwave Journal - Jan 2001) | |
| TA010 | Distortion In Voltage Variable Attenuators (Microwave Journal - Dec 1999) | |
| TA071 | Microwave Filter Design by Synthesis and Optimization (IEEE Microwave - Apr 2007) | |
| TA072 | Narrow Band Microwave Filter Design (IEEE Microwave - Oct 2007) | |
| TA076 | Bringing Commercial Manufacturing Practices To Phased Array Systems (RF GlobalNet - Jun 2009) | |
| TA077 | Commercial Practices Shatter Defense Manufacturing Paradigm (Microwave Product Digest - May 2009) | |
| TA083 | Speedy Switches Minimize Gate Lags (Microwaves & RF - March 2010) | |
| TA084 | RF Component Level Modeling for System Level Simulation (Microwave Journal - March 2010) | |
| TA086 | How VCO Tuning BW Affects Phase Noise (Microwaves & RF - June 2011) | |
| Products | TA001 | RF Digital Attenuators in Plastic MLP Packages - Product Feature (Microwave Journal - Oct 2000) |
| TA003 | ASIC Driver for GaAs FET Control Components - Technical Feature (Applied Microwave and Wireless - Dec 2000) | |
| TA006 | GaAs MMIC Switch Is Designed Around Low Capacitance MESFET - Design Feature (Microwaves & RF - Mar 2000) | |
| TA012 | A Unique Voltage Variable Attenuator for Wireless Markets - PIN Diode and Passive GaAs MMIC In Plastic SMT Package (Microwave Journal - Nov 2000) | |
| TA023 | 2.5 V GaAs pHEMT Switches for GSM Handsets (Microwave Journal Cover Feature - Jan 2002) | |
| TA037 | High Performance SiGe Amplifiers for Cordless and Wireless Applications (MPD - Feb 2004) | |
| TA038 | High Performance Wideband Amplifiers for Radar and SatCom Applications (Microwave Journal - Jan 2004) | |
| TA041 | A Surface-Mount Plastic-Packaged 1 to 18 GHz Low Noise Driver Amplifier (Microwave Journal - Sep 2004) | |
| TA053 | High Linearity RF Driver Amplifier Family For Wireless Communication Applications (Microwave Journal - Oct 2005) | |
| TA054 | Passive Components: A Brief History (Microwave Journal - Nov 2005) | |
| TA058 | Ku-band MMIC Amplifiers (Microwave Journal - Feb 06) | |
| TA059 | New Process Enables Wideband High Power GHz Amplifiers to Deliver Up to 20 Watts (Defense Electronics - Feb 2006) | |
| TA061 | High Harmonic Rejection Matching Filters for Quad-Band Amplifiers (Microwave Journal - May 06) | |
| TA062 | The Road From RFIC to SoC Cover Story (Microwave Journal- Jun 06) | |
| TA066 | Integrated Multifunction X-band MMIC Merges Microwave and Digital Functions (Defense Electronics - Oct 06) | |
| TA069 | A Monolithic High Power, High Linearity, Multi-Octave PIN Diode T/R Switch (Microwave Product Digest - Jul 07) | |
| TA070 | 1kW S-Band Pulsed Power Amplifier Using a Pallet Solution (Microwave Product Digest - Sep 2007) | |
| TA073 | Remote Sensing Technology for Automotive Safety Cover Story (Microwave Journal - Dec 2007) | |
| TA074 | A Spectrum of Radar Solutions (Microwave Product Digest - Sept 2009) | |
| TA075 | PIN Diode Performance Tradeoffs Across Package and Process Types (Microwave Journal - June 2009) | |
| TA079 | WiMAX Broadband Seitches - Why PIN Diodes? Featured Article (Microwave Product Digest - April 2009) | |
| TA080 | Series-Shunt SPST PIN Diode Element with Thermal Terminal Featured Article (Microwave Product Digest - Mar 2009) | |
| TA081 | DC to 6 GHz 50 W T/R Switch for High Linearity Applications (Microwave Journal - Feb 2009) | |
| TA082 | Class F Amplifier Boasts High Efficiency | |
| TA085 | Monolithic Semiconductor Technologies for Low Cost Phased Array Radar (Microwave Product Digest - February 2011) | |
| Test and Measurement | TA019 | Two-tone IMD Techniques - 7 rules to ensure the best characterization of non-linear RF components (RF Design - June 2001) |
| IC Processing/Reliability | TA002 | Backside Processing of GaAs wafers (Semiconductor International - Dec 2000) |
| TA015 | Dicing Improvements: Yield Enhancement, Throughput Increase And Die Size Reduction (GaAs MANTECH - 2001) | |
| TA017 | Development of a High Voltage mmW GaAs PIN Diode Switch (GaAs MANTECH - 2001) | |
| TA016 | Improved Backside Mounting Processes (GaAs MANTECH - 2001) | |
| TA022 | Benefits and Challenges in Decreasing GaAs Through Substrate Via Size and Die Thickness (GaAs MANTECH - 2002) | |
| TA028 | GaAs MMIC Processes Enable Multi-Function Integration, Increasing Reliability While Reducing Chip Size and Cost (Microwave Product Digest - April 2000) | |
| TA034 | Photoresist Application for 3D Features on Wafer Surfaces (Compound Semiconductor - June 2003) | |
| TA040 | Reliability Characteristics of M/A-COM's InGaP / GaAs HBT Process | |
| TA064 | Reliability Investigation and Characterization of Failure Modes in Schottky Diodes (Microelectronics Reliability - August 2006) | |
| TA065 | Replacement of Hexavalent Chromium Coatings for Electronic Housings and Enclosures | |
| TA078 | The Effects of Chemical Treatment and Storage Time on the Surface Chemistry of Semi-Insulating Gallium Arsenide (For CS MANTECH Conference - May 2009) |
